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//*****************************************************************************
// MSP430x47xx Demo - SD16, Using the Integrated Temperature Sensor
//
// Description: This example shows how to use the SD16 module's integrated
// temperature sensor (connected to input channel 6) to measure temperature.
// A single conversion is initiated and then the CPU is disabled by entering
// LPM0. Once the conversion has completed, a SD16 interrupt occurs and
// stores the result in variable "ADCresult". Next, the CPU wakes up and
// converts this value into two temperature values, one in degrees Celcius
// and one in degrees Farenheit. Test by setting a breakpoint at the line
// indicated below and running the program. Upon reaching the breakpoint,
// use the debugger's watch window to view degrees C (DegC) and degrees F
// (DegF).
// ACLK = LFXT1 = 32768 Hz, MCLK = SMCLK = DCO = 32 x ACLK = 1048576 Hz
// //* An external watch crystal on XIN XOUT is required for ACLK *//
// //* Minimum Vcc is required for SD16 module - see datasheet *//
// //* 100nF cap btw Vref and AVss is recommended when using 1.2V ref *//
//
// Sensor's temperature coefficient is 1.32mV/K (from 'F42x datasheet)
// Sensor's offset voltage ranges from -100mv to 100mV (assume 0)
// DegC = DegK - 273
// DegF = (DegC * 9/5) + 32
// Vref = 1200mV
// Vsensor = 1.32mV * DegK + Vsensor_offset (assuming 0mv for offset)
// Vsensor = (SD16MEM2-32768)/32768 * Vref/2
// DegK = (SD16MEM2 - 32768)/65536 * 1200/1.36
// DegK = (SD16MEM2 * 909)/65536 - 454
// DegC = (SD16MEM2 * 909)/65536 - 727 ( No need to simplify further, )
// DegF = (SD16MEM2 * 1636)/65536 - 1276 ( take advantage of HW multiplier )
// ( and simple binary division )
//
// MSP430x47xx
// -----------------
// /|\| XIN|-
// | | | 32kHz
// --|RST XOUT|-
// | |
// |A2.6+ | ( A2.6+, A2.6- connected internally )
// |A2.6- | ( to SD16's temperature sensor )
// | |
// | VREF |---+
// | | |
// | | -+- 100nF
// | | -+-
// | | |
// | AVss |---+
// | |
//
// P. Thanigai / K.Venkat
// Texas Instruments Inc.
// November 2007
// Built with CCE Version: 3.2.0 and IAR Embedded Workbench Version: 3.42A
//*****************************************************************************
#include <msp430x47x4.h>
unsigned int ADCresult;
unsigned long DegC = 0;
unsigned long DegF = 0;
void main(void)
{
volatile unsigned int i; // Use volatile to prevent removal
// by compiler optimization
WDTCTL = WDTPW + WDTHOLD; // Stop WDT
FLL_CTL0 |= XCAP14PF; // Configure load caps
for (i = 0; i < 10000; i++); // Delay for 32 kHz crystal to
// stabilize
SD16CTL = SD16REFON+SD16SSEL0; // 1.2V ref, SMCLK
SD16CCTL2 |= SD16SNGL+SD16IE ; // Single conv, enable interrupt
SD16INCTL2 |= SD16INCH_6; // Select Channel A6
for (i = 0; i < 0x3600; i++); // Delay for 1.2V ref startup
while (1)
{
SD16CCTL2 |= SD16SC; // Set bit to start conversion
__bis_SR_register(LPM0_bits + GIE); // Enter LPM0 w/ interrupts
DegC = ((unsigned long)ADCresult * 909)/65536 - 727;
// Calculate degrees Celcius
DegF = ((unsigned long)ADCresult * 1636)/65536 - 1276;
// Calculate degrees Farenheit
_NOP(); //SET BREAKPOINT HERE
}
}
#pragma vector=SD16A_VECTOR
__interrupt void SD16AISR(void)
{
switch (SD16IV)
{
case 2: // SD16MEM Overflow
break;
case 4: // SD16MEM0 IFG
break;
case 6: // SD16MEM1 IFG
break;
case 8: // SD16MEM2 IFG
ADCresult = SD16MEM2; // Save CH2 results (clears IFG)
break;
}
__bic_SR_register_on_exit(LPM0_bits); // Exit LPM0
}
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